Email: contact@moldad.com Tel: 0000 0000
Constructed with polyimide (PI) substrate featuring excellent heat resistance. It is used for cell edge sealing and electrode protection, available with silicone or acrylic adhesive options.
Constructed with polyimide (PI) substrate featuring excellent heat resistance. It is used for cell edge sealing and electrode protection, available with silicone or acrylic adhesive options.
Features
Special PSA: Silicone-free pressure-sensitive adhesive, moisture-free, good adhesion to various battery components
Outstanding heat resistance: PI substrate withstands temperatures above 300℃ for high-temperature processes
Balanced unwinding force: Suitable for diverse processes and automatic taping machines
Two adhesive options: Acrylic adhesive for electrode protection; silicone adhesive for PACK applications
Contact: YF
Phone: 13423839438
Tel: 0000 0000
Email: contact@moldad.com
Add: 1st Floor, No.6 Liaokeng Minsheng 4th Road, Bao'an District, Shenzhen, P.R.China